Olaniyan T, Odedeyi P, Ejiofor V. Deformation and material removal mechanisms of nanometric cutting of silicon at different depths of cuts using molecular dynamics simulation. Technoscience [Internet]. 2025 Dec. 31 [cited 2026 Jan. 25];4:119-27. Available from: https://journals.kwasu.edu.ng/index.php/technoscience/article/view/600